Packaging Innovation Day is Borderless Success

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With over 150 international attendees representing 92 leading companies in the world of eCommerce and logistics, the 2025 edition of CMC’s Innovation Day on Wednesday concluded with outstanding success. Held at the CMC Packaging Automation headquarters in Città di Castello, the event reaffirmed the company’s central role as a global benchmark in packaging automation.

This year’s theme, LIMITLESS, served as the guiding thread for a day filled with insights, visionary thinking, and innovations that are reshaping the future of right-sized packaging. The morning conference featured presentations from international customers, system integrators, and industry leaders who shared real-world case studies and emerging market trends. Logistics Business will bring you the full story in our next issue.

Among the speakers were DHL – who presented its project with Adidas; Avantor and Element Logic – who highlighted their joint project in Germany and the crucial role of CMC Genesys integration with AutoStore; and eMAG – the largest eCommerce player in Eastern Europe, who presented its packaging automation project developed in partnership with CMC. Exotec offered insight on the importance of right-sized packaging in complementing the new Skypod system.

In the afternoon, guests visited CMC’s production facility for exclusive demonstrations of the full range of on-demand packaging solutions and two of 2025’s key technological innovations:

• CMC Super Vertical: an ultra-compact machine capable of producing right-sized boxes and mailers, specifically designed for small to mid-sized distribution centers. It is ideal for retrofit projects and for maximizing space without compromising productivity.

• New CMC Genesys Concept and Genesys PRIMA: a scalable and modular machine, able to operate either as a stand-alone box-first solution or integrated within warehouse workflows. With the integration of CMC’s patented Vary-Tote technology, the system can handle irregularly shaped products within advanced pick-to-pack processes.

The event also saw a strong presence of system integrators from across the globe, eager to explore the flexibility and scalability of CMC’s solutions for end-to-end project implementations.
Underscoring the event’s success and rising international demand, CMC announced that, for the first time, Innovation Day will also be held at its Tech Centre in Atlanta, Georgia on July 16th. Already functioning as a training hub and testing lab for clients and technology partners, the U.S. site will host the second edition of CID25 to offer an immersive experience to the North American market.

“Integration is no longer optional — it’s essential. At CMC, we believe that innovation must start with listening. Since 1980, we’ve helped companies improve their fulfillment processes and achieve their sustainability goals through high-speed, high-performance technology. In recent years, market demand has shifted: businesses now need scalable solutions that can be deployed in existing, space-constrained environments. This is what has driven our R&D efforts. The result is a new generation of ultra-compact, intelligent systems that can handle a wide variety of items without compromising on package integrity or throughput. With CID25, we wanted to demonstrate that when innovation is driven by vision and passion, there are no limits,” said Francesco Ponti, CMC Executive Chairman and CEO.

Tania Torcolacci, Head of Global Marketing and Strategic Partnerships at CMC, added: “The excitement we received during the event encouraged us to extend Innovation Day to the U.S., where we aim to replicate the energy, dialogue, and value generated here in Italy.”

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